Flat bars
Round bars
Hexagon bars| Alloy | Density approx. | Composition in % | Important tempers | Tensile Strength Rm N/mm2 | Yield Stress Rp0,2 N/mm2 | Elongation A % | Hardness HB | Electr. conductivity MS/s | |
|---|---|---|---|---|---|---|---|---|---|
| Cu-ETP DIN EN 13601 | CW004A | 8,9 | Cu ≥ 99,90 incl. Ag ≤ 0,015 O ≤ 0,040 | Bars M R300 R250 | * ≥ 300 ≥ 250 | * ≥ 260 ≥ 180 | * ≥ 8 ≥ 15 | * HB 75 - 100 HB 65 - 90 | * ≥ 57,0 ≥ 57,0 |
| Comparable Specifications: E-Cu57, 2.0060, DIN 1787 C11000 UNS C101, BS 1433 Oxygen containing Cu-ETP offers high electrical conductivity, but poor weldability and hard soldering. Well suitable for soft soldering. | |||||||||
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